Yeongin Kim Research Group - University of Cincinnati

2024 Spring
EECE 2051C Network Analysis
 Students will understand and apply fundamental electrical engineering concepts and laws: develop basic skills for analyzing resistive networks and for solving simple first- and second-order networks containing inductors and capacitors; develop an understanding of the steady-state response of a network to sinusoidal forcing functions through the use of phasors and impedance concepts; understand average, rms, instantaneous, and reactive power; learn to calculate and interpret circuit frequency response and resonance.


2023 Fall
EECE 5153/6053 2D/3D printing technologies for electronics/optoelectronics
 This course provides an overview of 2D/3D fabrication and its applications for electronics/optoelectronics/energy. Materials for electronics/optoelectronics/energy and their electrical/mechanical/chemical properties are introduced. The fundamental principles and technologies of various 2D/3D fabrication methods are covered. Fabricated device structures are described to show a variety of applications of 2D/3D fabrication. This course incorporates a hands-on 3D printing project using an on-campus 3D print farm.


2023 Spring
EECE 5153/6053 2D/3D printing technologies for electronics/optoelectronics
 This course provides an overview of 2D/3D printing technologies and its applications for electronics/optoelectronics. Printable materials for electronics/optoelectronics, such as polymers, metals, ceramics, and nanomaterials, are introduced. The fundamental principles and technologies of various 2D/3D printing techniques will be covered, including jet printing, extrusion, direct/indirect replicate printing, photopolymerization, powder bed fusion, and selective laser sintering. Printed device structures, including sensors, actuators, displays, circuits, antenna, and integrated optics, are described to show applications of 2D/3D printing for electronics/optoelectronics, such as wearables, implantable devices, large-area electronics, robotics, 3D wireless antennas, 3D image sensors and displays, and biosensors. This course incorporates an optional on-campus field trip to 3D printing facility.