Equipment in our Labs
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Plasma Reactors
Below is a dual mode, microwave (MW) and low frequency (LF) plasma reactor [PLASMAtech, Erlanger, KY]. It can be operated in a batch or continuous
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PlasmaTech Reactor |
View of PlasmaTech Reactor Chamber |
Recently, a time-of-flight mass spectrometer (TOF-MS), residual gas analyzer (RGA), and optical emission spectrometer (OES) were added to this reactor, as shown below:
Time-of-Flight Mass Spectrometer and Residual Gas Analyzer
We also have the capability to do IR and XPS of plasma treated surfaces in-situ (without exposing the samples to atmosphere. This equipment is very important to the study of the structure of interfaces, as exposure to atmosphere alters the chemistry.
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Reactor with In-situ IR |
Reactor with In-situ XPS |
We have two more plasma reactors used to deposit films, etch and functionalize surfaces shown below:
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Microwave Power Plasma Reactor |
Radio Frequency Power Plasma Reactor |
Spectroscopic Characterization Tools
We use many different characterization tools to investigate the surfaces that we engineer. Infrared and Raman spectroscopy enables us to investigate the chemical bonding present in a material. XPS allows us to determine the chemical composition of a surface (top 10 nm). The variable angle spectroscopic ellipsometer is also useful to determine film thickness and refractive index.
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Nicolet Infrared and Raman Spectrometer, with reflection and attenuated total reflection accessories. |
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Variable angle spectroscopic ellipsometer (VASE) |
Other Equipment
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Polymer injection molder |
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Contact angle goniometer and tensiometer |
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Scratch Tester |
We also have use of all the facilities at the Materials Characterization Center.
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